厂家**8188EUS车载导航低功耗USB接口2.4G小体积wifi无线模块

 
BL-R8188EU1（EUS）
Product Specification
                  WLAN 11b/g/n USB MODULE





Approval Sheet

Customer	
Date	
Product Type	BL-R8188EU1
Part NO.	
Blink Approve Field

ENGINEER	
QC	
SALES
		
Customer Approve Field

ENGINEER	
QC	
MANUFACTORY	
PURCHASING
			

Content
Content	1
0.	Revision History	2
1. General Description	2
2.	The range of applying	2
3. Product Specification	2
3.1 Function Block diagram	2
3.2 Electrical and Performance Specification	3
3.3 DC Characteristic	3
3.4 RF Characteristic	4
3.5 Product Photo	5
3.6 Mechanical Specification	5
3.7 Product Pin Definition	6
4. Supported platform	7
5. Peripheral Schematic Reference Design	7
6. Package Information	8
7. Typical Solder Reflow Profile	8
8. Precautions for use	9













0.	Revision History
Date	Document
revision	Product
revision	Change Description
2014/06/18	1.0	V2.7	Update format , change product size tolerance.
1. General Description
BL-R8188EU1 product is designed base on Realtek RTL8188EUS chipset .It combines CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11/b/g/n compatible. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless network function on the laptop/desktop/MID and other wireless devices easily . This module has implemented some efficient mechanisms in its software and hardware to maximize the performance.
2.	The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking.
3. Product Specification
3.1 Function Block diagram
 
3.2 Electrical and Performance Specification 
Item	Description
Product Name 	BL-R8188EU1
Major Chipset	RTL8188EUS
Host Interface 	USB2.0
Standard	IEEE 802.11b, IEEE 802.11g,IEEE 802.11n,
Frequency Range	2.4GHz~2.4835GHz
Modulation Type	802.11b: CCK, DQPSK, DBPSK
802.11g: 64-QAM,16-QAM, QPSK, BPSK
802.11n: 64-QAM,16-QAM, QPSK, BPSK
Working Mode	Infrastructure,  Ad-Hoc
Data Transfer Rate	1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and
maximum of 150Mbps
Spread Spectrum	IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division
Multiplexing)
Sensitivity @PER	1M: -90dBm@8%PER
6M: -88dBm@10%PER  
11M:-86dBm@8%PER
54M:-73dBm@10%PER
135M:-68dBm@8%PER

 RF Power（Typical）	16dBm@11b, 14dBm@11g , 13dBm@11n,
Antenna type	Connect to the external antenna through the half hole
The transmit distance	Indoor 100M, Outdoor 300M, according the local environment
Dimension(L*W*H)	13.0 x 12.3 x 1.55mm (LxWxH) ;Tolerance: +-0.2mm
Power supply	3.3V +/-0.2V
Power Consumption	standby mode  , 
TX mode 
Clock source	40MHz
Working Temperature 	0°C to +50°C
Storage temperature	-40°C ~ +85°C
3.3 DC Characteristic
Terms	Contents
Specification : IEEE802.11b
Mode	DSSS / CCK
Frequency	2412 – 2484MHz
Data rate	1, 2, 5.5, 11Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	257	263	271	mA
Rx mode	80	82	84	mA
Sleep mode	78	80	82	mA
Specification : IEEE802.11g
Mode	OFDM
Frequency	2412 - 2484MHz
Data rate	6, 9, 12, 18, 24, 36, 48, 54Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	244	245	245	mA
Rx mode	88	89	89	mA
Sleep mode	78	80	82	mA
Specification : IEEE802.11n
Mode	OFDM
Frequency	2412 - 2484MHz
Data rate	6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	201	207	214	mA
Rx mode	90	93	94	mA
Sleep mode	78	80	82	mA
3.4 RF Characteristic
Mode	Rate(Mbps)	Power(dBm)	EVM(dB)	Sensitivity(dBm)
		CH1	CH7	CH13	CH1	CH7	CH13	CH1	CH7	CH13
11b	1	17.43	17.36	17.20	-28.27	-28.11	-27.86	-95	-94	-94
	11	17.91	17.77	17.68	-23.42	-24.02	-24.21	-86	-86	-86
11g	6	15.39	15.22	15.33	-32.02	-31.43	-31.17	-90	-90	-90
	54	14.79	14.81	15.11	-33.03	-32.63	-32.31	-74	-73	-73
11n
HT20	MCS0	15.02	15.12	15.33	-32.14	-31.66	-32.88	-90	-90	-90
	MCS7	14.75	14.67	14.66	-32.40	-31.29	-31.60	-70	-70	-70

Mode	Rate(Mbps)	Power(dBm)	EVM(dB)	Sensitivity(dBm)
		CH3	CH7	CH11	CH3	CH7	CH11	CH3	CH7	CH11
11n
HT40	MCS0	15.52	15.53	15.33	-32.54	-31.47	-32.49	-88	-88	-88
	MCS7	14.65	14.6	14.76	-32.51	-31.39	-31.92	-68	-68	-68



3.5 Product Photo
             TOP                                         Bottom
        





3.6 Mechanical Specification
 Module dimension: Typical (L x W x H): 13mmx12.3mmx1.55mm   Tolerance : +/-0.2mm
 
3.7 Product Pin Definition
 


4. Supported platform 
Operating System	CPU Framework	Driver
WIN2000/XP/VISTA/WIN7	X86 Platform	Enable
LINUX2.4/2.6	ARM, MIPSII	Enable
WINCE5.0/6.0	ARM ,MIPSII	Enable

5. Peripheral Schematic Reference Design
 











6. Package Information
 
7. Typical Solder Reflow Profile
 
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. 
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.

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