供应联发科MT7601UN无线wifi智能usb接口模块

 

BL-R7601MU2

Product Specification

IEEE 802.11b/g/n (1T1R) WLAN USB Module
          Version: 3.1


Customer	
Date	
Model Name	BL-R7601MU2
Part NO.	
Blink Approve Field

ENGINEER	
QC	
SALES
		
Customer Approve Field

ENGINEER	
QC	
MANUFACTORY	
PURCHASING
			

Content
Content	1
1. General Description	2
2.	The range of applying	2
3. Product Specification	2
3.1 Function Block diagram	2
3.2 Electrical and Performance Specification	3
3.3 DC Characteristic	3
3.4 RF Characteristic	4
3.4 Product Photo	5
3.5 Mechanical Specification	5
3.6 Product Pin Definition	6
4. Supported platform	6
5. WiFi RF Circuit reference pictures	6
6. Package Information	7
7. Typical Solder ReflowProfile	7
8. Precautions for use	7

















1. General Description
BL-R7601MU2 product accord with FCC CE is a highly integrated Wi-Fi single chip which support 150 Mbps PHY rate. It fully complies with IEEE802.11n and IEEE802.11b/g standard, offering feature-rich wireless connectivity at high standard, and delivering reliable, cost-effective throughput from an extended distance.Optimized RF architecture and baseband algorithms provide superb performance and lower power consumption. Intelligent MAC design deploys a high efficient DMA engine and hardware data processing accelerators which offloads the host processor.
2.	The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking.

3. Product Specification
3.1 Function Block diagram
 




3.2 Electrical and Performance Specification
Item	Description
Product Name 	BL-R7601MU2
Major Chipset	MT7601
Host Interface 	USB2.0
Standard	IEEE 802.11b, IEEE 802.11g,IEEE 802.11n
Frequency Range	2.4GHz~2.4835GHz
Modulation Type	802.11b: CCK, DQPSK, DBPSK
802.11g: 64-QAM,16-QAM, QPSK, BPSK
802.11n: 64-QAM,16-QAM, QPSK, BPSK
Working Mode	Infrastructure,  Ad-Hoc
Data Transfer Rate	802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n: 150Mbps(MAX)
Spread Spectrum	IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing)
Sensitivity @PER	135M:-68dBm@10%PER
54M:-74dBm@10%PER
11M:-86dBm@8%PER
6M: -90dBm@10%PER
1M: -92dBm@8%PER

RF Power(Typical)	135M:14dBm,  54M:15dBm, 11M:17dBm
Antenna type	Connect to the external antenna through the half hole
The transmit distance	Indoor 100M, Outdoor 300M, according -the local environment
Dimension(L*W*H)	13.0*12.3*1.5mm (LxWxH) ，Tolerance: +-0.15mm
Power supply	3.3V +/-0.15V
Power Consumption	standby mode  , 
TX mode 
Clock source	40MHz
Working Temperature 	0°C to +50°C
Storage temperature	-40°C to +85°C
3.3 DC Characteristic
Terms	Contents
Specification : IEEE802.11b
Mode	DSSS / CCK
Frequency	2412 – 2484MHz
Data rate	1, 2, 5.5,11Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	239	245	249	mA
Rxmode	91	92	93	mA
Sleepmode	47	48	48	mA
Specification : IEEE802.11g
Mode	OFDM
Frequency	2412- 2484MHz
Data rate	6, 9, 12, 18, 24, 36, 48, 54Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	149	150	153	mA
Rxmode	92	93	100	mA
Sleepmode	46	48	49	mA
Specification : IEEE802.11n
Mode	OFDM
Frequency	2412- 2484MHz
Data rate	6.5,13, 19.5,26, 39, 52, 58.5, 65Mbps
DC Characteristics	min	Typ.	max.	unit
TX mode	151	152	153	mA
Rxmode	91	92	93	mA
Sleepmode	47	48	49	mA
3.4 RF Characteristic
Mode	Rate(Mbps)	Power(dBm)	EVM(dB)	Sensitivity(dBm)
		CH1	CH7	CH13	CH1	CH7	CH13	CH1	CH7	CH13
11b	1	17.43	17.79	17.48	-31.18	-32.78	-31.52	-95	-95	-95
	11	17.50	17.26	17.91	-32.87	-3*	-33.41	-89	-89	-89
11g	6	17.58	17.28	17.49	-34.21	-33.18	-33.87	-90	-90	-90
	54	16.70	16.57	16.33	-30.42	-31.25	-31.02	-74	-74	-74
11n
HT20	MCS0	17.32	17.24	17.48	-28.97	-29.18	-29.65	-88	-88	-88
	MCS7	16.86	16.40	16.12	-30.67	-30.98	-31.70	-70	-70	-70
11n
HT40	MCS0	17.54	17.84	17.26	-30.54	-30.21	-30.47	-89	-89	-89
	MCS7	16.38	16.06	16.12	-31.41	-31.28	-31.07	-69	-69	-69



3.4 Product Photo
 TOP                                  Bottom
  



3.5 Mechanical Specification
 
13.0mm*12.3mm*1.5mmTolerance: +-0.15mm

3.6 Product Pin Definition
 
4. Supported platform
Operating System	CPU Framework	Driver
WIN2000/XP/VISTA/WIN7	X86 Platform	Enable
LINUX2.4/2.6	ARM, MIPSII	Enable
WINCE5.0/6.0	ARM ,MIPSII	Enable
5. WiFi RF Circuit reference pictures
 
Note: 1.Pls reserve a “pi” circuit for antenna matching.
2. The RF circuit needs to keep 50 Ω impedance.
3. The USB differential pair needs to keep 90 Ω impedance.
6.Package Information
 
7. Typical Solder ReflowProfile
 
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. 
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.

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